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interconnect solution
high-frequency high-speed seri
other solutions
interconnect solution
high-frequency high-speed seri
other solutions
interconnect solution
high-frequency high-speed seri
other solutions
introduction of high frequency and high speed solutions
features:
•excellent thermal coefficient of dielectric constant
•excellent pim performance
•high thermal conductivity ideal for higher power designs.
•reduced coefficient of thermal
expansion in z-direction (ctez)
•tightest commercial laminate dk tolerance for impedance control
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product characteristics: ceramic filler/teflon microwave composites the lowest insertion loss of the same grade the lowest dielectric loss of the same grade the electronic phase stability to temperature change the high thermal conductivity the lowest dielectric constant tolerance ( 0.02) and thickness tolerance[ 查看详情]
features:
•extremely low loss tangent (0.0009 @10ghz)
•excellent dimensional stability
•excellent product performance uniformity
•“best in class” thermal conductivity( 0.8 w / m k )
•dielectric constant stability across wide temperatures( - 9 pp m / ℃)
•very low loss tangent provides higher amplifier or antenna efficiency
•priced affordably for commercial application
•high peel strength for reliable
copper adhesion in thermally stressed applications
•meet military standard for shock and impact resistance test
features and benefits:
•low dielectric constant ( @10ghz dk 3.20)and dissipation (@10ghz df 0.0030)
•high glass transition temperature(tg 280℃)
•low press temperature 180℃
•reliable multiple press characteristics
•good blind hole filling effect
•excellent thickness uniformity
features:
•ceramic/ptfe microwave composite
•lowest insertion loss in class
•“best-in-class” loss tangent (0.0011)
•electrical phase stability
•high thermal conductivity
•tightest dielectric constant (±0.03) and thickness tolerance
features and benefits:
•low dielectric loss(0.0013 @10ghz)
•excellent mechanical properties vs. temperature
•reliable strip line and multi-layer board constructions
•suitable for use with epoxy glass multilayer board hybrid designs
•stable dielectric constant vs.
temperature and frequency
•suitable for applications sensitive to
temperature change
•excellent dimensional stability